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    <description>Latest 20 threads of 散热讨论区</description>
    <copyright>Copyright(C) EDA手把手</copyright>
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      <title>Semiconductor and IC Package Thermal Metrics</title>
      <link>https://mybesteda.com/discuz/forum.php?mod=viewthread&amp;tid=230</link>
      <description><![CDATA[推荐一篇好文章
Semiconductor and IC Package Thermal Metrics]]></description>
      <category>散热讨论区</category>
      <author>Antenna</author>
      <pubDate>Wed, 08 Dec 2021 08:07:25 +0000</pubDate>
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      <title>器件降额准则</title>
      <link>https://mybesteda.com/discuz/forum.php?mod=viewthread&amp;tid=99</link>
      <description><![CDATA[说到散热就涉及到元器件最大耐温，这就是热设计的标靶，元器件的间隔准则可以详细参考：中国可靠性网站

附件是该网站总结的论文：深圳市企业设计技术标准-元器件降额准则.pdf]]></description>
      <category>散热讨论区</category>
      <author>Thermal</author>
      <pubDate>Mon, 05 Mar 2018 15:03:17 +0000</pubDate>
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